研究業績
[微細接合学分野]分野指定
雑誌掲載論文
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| 表 題 | 掲載誌 | 著 者 |
| A comparative numerical study of thermos-mechanical behavior among various IMC joints under thermal cycling condition | スマートプロセス学会誌,13,2(2024),83-89 | Xunda Liu Hiroaki Tatsumi Hiroshi Nishikawa |
Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices  |
ACS Applied Electronic Materials,6,(2024),1718-1728 | Chuncheng Wang Hiroaki Tatsumi Liang Xu Tao Zhao Pengli Zhu Rong Sun Hiroshi Nishikawa |
| Quasi-Direct Cu-Si3N4 Bonding using Multi-layered Active Metal Deposition for Power-Module Substrate |
Materials and Design,238,(2024),112637 | Hiroaki Tatsumi Seongjae Moon Makoto Takahashi Takahiro Kozawa Eiki Tsushima Hiroshi Nishikawa |
| Analysis of microstructures and fractures in Ag-In transient liquid phase bonded joints |
Materials Science and Engineering: A,892,(2024),146045 | Xunda Liu Hiroaki Tatsumi Jianhao Wang Zhi Jin Zhong Chen Hiroshi Nishikawa |
| Interfacial reactions between In and Ag during solid liquid interdiffusion process |
Surfaces and Interfaces,45,(2024),103844 | Xunda Liu Fupeng Huo Jianhao Wang Hiroaki Tatsumi Zhi Jin Zhong Chen Hiroshi Nishikawa |
| Sn-Bi-Zn-In合金のBi含有量が微細組織と機械的特性に及ぼす影響 |
溶接学会論文集,41,4(2023),348 | 中脇 啓貴 巽 裕章 新田 隼也 Chih-han Yang Shih-kang Lin 西川 宏 |
| Impact of crystalline orientation on Cu-Cu solid-state bonding behavior by molecular dynamics simulations |
Scientific Reports,13,(2023),23030 | Hiroaki Tatsumi C.R. Kao Hiroshi Nishikawa |
| Thermomechanical Properties of Zeta (Ag3In) Phase |
Materials,16,(2023),7115 | Xunda Liu Hiroaki Tatsumi Zhi Jin Zhong Chen Hiroshi Nishikawa |
| Electromigration-induced microstructure evolution and failure mechanism of sintered nano-Ag joint | Materials Characterization,205,(2023),113309 | Zhi Jin Fupeng Huo Jianhao Wang Xunda Liu Y. C. Chan Hiroshi Nishikawa |
| Highly reliable micro-scale Cu sintered joint by oxidation-reduction bonding process under thermal cycling | Microelectronics Reliability,150,(2023),115123 | Min-Su Kim Dongjin Kim Myong-Hoon Roh Hiroshi Nishikawa |
| Impact reliability enhancement approach of Sn-Bi-Zn-in alloy bumps under high-humidity and high-temperature tests | Journal of Materials Research and Technology,27,(2023),7013-7023 | Zhi Jin Shunsuke Fujiwara Junichi Takenaka Koichi Hagio Hiroshi Nishikawa |
| Strength-enhanced Sn-In low-temperature alloy with surface-modified ZrO2 nanoparticle addition |
Journal of Materials Science: Materials in Electronics,34,(2023),2066 | Shunya Nitta Hiroaki Tatsumi Hiroshi Nishikawa |
| Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints |
Polymers,15,(2023),4168 | Peng Zhang Songbai Xue Lu Liu Jianhao Wang Hiroaki Tatsumi Hiroshi Nishikawa |
| 電磁波シールドパッケージにおけるモールド樹脂とスパッタ成膜間の界面挙動 |
スマートプロセス学会誌,12,5(2023),291-298 | 本間 荘一 岡田 大地 澤登 昭仁 山本 進 井本 孝志 西川 宏 |
| Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound |
Intermetallics,162,(2023),108028 | Xunda Liu Hiroaki Tatsumi Zhi Jin Zhong Chen Hiroshi Nishikawa |
| Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive |
Materials Characterization,203,(2023),113150 | Jianhao Wang Shogo Yodo Hiroaki Tatsumi Hiroshi Nishikawa |
| Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles |
Materials Letters,349,(2023),134845 | Jianhao Wang Shogo Yodo Hiroaki Tatsumi Hiroshi Nishikawa |
| Comparative Study of Sn-based Solder Wettability on Aluminum Substrate |
溶接学会論文集,41,(2023),26a | Jiahui Li Hiroaki Tatsumi Hiroshi Nishikawa |
国際会議発表論文
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| 表 題 | 掲載誌・会議 | 著 者 |
| Effect of surface microstructure on joints using nanoporous Cu sheet for power devices | Proc. of the 24th European Microelectronics Packaging Conference (EMPC2023),,(2023), | Hiroshi Nishikawa Byungho Park Mikiko Saito Jun Mizuno |
国内会議発表論文
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| 表 題 | 掲載誌・会議 | 著 者 |
| Sn-Bi-Zn-In合金の微細組織が変形挙動に及ぼす影響 | 第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集,,(2024),29-33 | 中脇 啓貴 巽 裕章 Chih-han Yang Shih-kang Lin 西川 宏 |
| ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価 | 第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集,,(2024),112-113 | 巽 裕章 磯野 浩 平瀬 加奈 井手 拓哉 西川 宏 |
| 青色半導体レーザを用いた純銅リボンはんだ付中の温度分布と微細組織の評価 | 第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集,,(2024),49-53 | 貴田 優希 巽 裕章 竹中 啓輔 佐藤 雄二 塚本 雅裕 西川 宏 |
| 「Sn-In／ZrO2ナノ粒子複合合金金におけるナノ粒子表面の分散性への影響 | 第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集,,(2023),355-358 | 新田 隼也 巽 裕章 西川 宏 |
| 青色半導体レーザを用いた純銅リボンはんだ付プロセスの短時間化 | 第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集,,(2023),291-294 | 貴田 優希 巽 裕章 竹中 啓輔 佐藤 雄二 塚本 雅裕 西川 宏 |
国際会議発表，国内学会発表
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| 表 題 | 会議・大会 | 発表者 |
| Bonding strength of ENIG joint using micro-sized Ag particles with submicron ceramic particles | TMS2024 Annual Meeting & Exhibition,,(2024.03.03-2024.03.07), | Jianhao Wang Shogo Yodo Hiroaki Tatsumi Hiroshi Nishikawa |
| Tensile strength of Sn-In Eutectic Solder with Surface Modified ZrO2 Nanoparticles | The Advanced Materials Research Grand Meeting (MRM2023/IUMRS-ICA2023),Kyoto, Japan,(2023.12.11-2023.12.16), | Shunya Nitta Hiroaki Tatsumi Hiroshi Nishikawa |
| Enhanced Thermal Conductivity in Micro Composite Structure Joints Utilizing Porous Cu Sheets | The 5th International Conference on Nanojoining and Microjoining (NMJ 2023),Leipzig, Germany,(2023.11.27-2023.11.29), | Hiroaki Tatsumi Hiroshi Nishikawa |
| Sn-Bi-Zn-In合金の延性改善の検討 | 2023年度 スマートプロセス学会 学術講演会,大阪大学 中之島センター,(2023.11.10), | 中脇 啓貴 巽 裕章 Chih-han Yang Shih-kang Lin 西川 宏 |
| Synthesis of macroporous microspheres through a thermal decomposition in water vapor and its application to nanoparticle collection | The 3rd International Symposium on Design & Engineering by Joint Inverse Innovation for Materials Architecture (DEJI2MA-3),Tokyo,(2023.10.20), | Takahiro Kozawa Hiroaki Tatsumi Hiroshi Nishikawa |
| 異種材料接合部の界面理解に向けた密度汎関数理論計算 | プラズマシミュレーターシンポジウム２０２３ (PSS2023),オンライン,(2023.09.26-2023.09.27), | 巽 裕章 新田 隼也 伊藤 篤史 高山 有道 西川 宏 |
| Effect of bonding condition on joint strength using Sn-coated Cu particles for high-temperature applications |
The 76th IIW Annual Assembly,Singapore,(2023.07.16-2023.07.21), | Hiroshi Nishikawa Xiangdong Liu Sijie Huang |
講演
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| 表 題 | 会議・講演会 | 講演者 |
| Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding Behavior | The 2023 Materials Research Society-Taiwan International Conference (2023 MRSTIC),Hsinchu, Taiwan,(2023.11.17-2023.11.20) | Hiroaki Tatsumi |
| Potential of low temperature soldering using hypoeutectic Sn-Bi alloys |
7th International Conference on Advanced Electromaterials ,Korea,(2023.10.31-2023.11.03) | Hiroshi Nishikawa |
| High-Thermal-Performance Power Semiconductor Module using Solder/Copper Composite Joints | The 3rd International Symposium on Design & Engineering by Joint Inverse Innovation for Materials Architecture (DEJI2MA-3),Tokyo,(2023.10.20) | Hiroaki Tatsumi |
受賞
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| 賞 名 | 授与機関 | 受賞者 |
| Mate2024優秀論文賞 | (一社)スマートプロセス学会 エレクトロニクス生産科学部会、(一社)溶接学会 マイクロ接合研究委員会 | 中脇 啓貴 巽 裕章 Chih-han Yang Shih-kang Lin 西川 宏 |
| 論文賞 | （一社）スマートプロセス学会 | 西川 宏 |