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Region of Research
The main research objectives are for electronics packaging to develop advanced joint materials, to establish advanced micro joining processes, and to elucidate the mechanisms of the micro joining processes. Especially, the creation of the functional joint materials, the development of novel advanced micro processes by various energy sources, the understanding of interfacial behaviors in nano-/micro-scale, and the enhancement of the highly reliable joints based on the control of interfacial structure and performance are performed.
Current Research Subjects
- Development and evaluation of advanced micro joining process
- Elucidation of micro joining phenomena and defect suppression
- Control and analysis of microstructure at soldered interface
- Development of eco-friendly fluxless soldering process using a reducing atmosphere
- Formation of high heat-resistance joint using three-dimensional nanostructure
- Simulation-based evaluation of micro joints nanostructure
Prof.
H. Nishikawa
Assoc.Prof.
H. Tatsumi
Assist.Prof.
T.Kozawa
S. A. Researcher
T. Naoe
S. A. Researcher
Z. Jin
S. A. Researcher
J. Wang
Micro joining process using a transient liquid phase bonding (TLPB) method
(a)TLPB process and microstructure of joint using Sn-coated Cu particles
(b)TLPB process and microstructure of joint using Sn-Bi solder particles + Cu particles
Microstructure of sintered joint using Ag nanoparticle paste
(a)Serial sectioning of Ag sintered layer by FIB/SEM system
(b)Reconstructed 3D image of Ag sintered layer
(c)Reconstructed 3D pore distribution into Ag sintered layer
Our Researches